| PCBA Capability | |
| Automatic equipment | Description |
| Laser marking machine PCB500 | Marking range: 400*400mm |
| Speed: ≤7000mm/S | |
| Maximum power: 120W | |
| Q-switching, Duty Ratio: 0-25KHZ; 0-60% | |
| Printing machine DSP-1008 | PCB size: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Stencil size: MAX:737*737mm MIN:420*520mm | |
| Scraper pressure: 0.5~10Kgf/cm2 | |
| Cleaning method: Dry cleaning, wet cleaning, vacuum cleaning (programmable) | |
| Printing speed: 6~200mm/sec | |
| Printing accuracy: ±0.025mm | |
| SPI | Measuring principle: 3D White Light PSLM PMP |
| Measurement item: Solder paste volume, area, height, XY offset, shape | |
| Lens resolution: 18um | |
| Precision: XY resolution: 1um; High speed: 0.37um | |
| View dimension: 40*40mm | |
| FOV speed: 0.45s/FOV | |
| High speed SMT machine SM471 | PCB size: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Number of mounting shafts: 10 spindles x 2 cantilevers | |
| Component size: Chip 0402(01005 inch) ~ □14mm(H12mm) IC,Connector(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Mounting accuracy: chip ±50um@3ó/chip, QFP ±30um@3ó/chip | |
| Mounting speed: 75000 CPH | |
| High speed SMT machine SM482 | PCB size: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Number of mounting shafts: 10 spindles x 1 cantilever | |
| Component size: 0402(01005 inch) ~ □16mm IC,Connector(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Mounting accuracy: ±50μm@μ+3σ (according to standard chip's size) | |
| Mounting speed: 28000 CPH | |
| HELLER MARK III Nitrogen reflux furnace | Zone: 9 heating zones, 2 cooling zones |
| Heat source: Hot air convection | |
| Temperature control precision: ±1℃ | |
| Thermal compensation capacity: ±2℃ | |
| Orbital speed: 180—1800mm/min | |
| Track width range: 50—460mm | |
| AOI ALD-7727D | Measuring principle: The HD camera obtains the reflection state of each part of the three-color light irradiating on the PCB board, and judges it by matching the image or logical operation of gray and RGB values of each pixel point |
| Measurement item: Solder paste printing defects, parts defects, solder joint defects | |
| Lens resolution: 10um | |
| Precision: XY resolution: ≤8um | |
| 3D X-RAY AX8200MAX | Maximum detection size: 235mm*385mm |
| Maximum power: 8W | |
| Maximum voltage: 90KV/100KV | |
| Focus size: 5μm | |
| Safety (radiation dose): ＜1uSv/h | |
| Wave soldering DS-250 | PCB width: 50-250mm |
| PCB transmission height: 750 ± 20 mm | |
| Transmission speed: 0-2000mm | |
| Length of preheating zone: 0.8M | |
| Number of preheating zone: 2 | |
| Wave number: Dual wave | |
| Board splitter machine | Working range: MAX:285*340mm MIN:50*50mm |
| Cutting precision: ±0.10mm | |
| Cutting speed: 0~100mm/S | |
| Speed of rotation of spindle: MAX:40000rpm | |
| Technology Capability | ||
| Number | Item | Great capability |
| 1 | base material | Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc. |
| 2 | Solder mask color | green, red, blue, white, yellow, purple，black |
| 3 | Legend color | white, yellow, black, red |
| 4 | Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver |
| 5 | Max. layer-up(L) | 50 |
| 6 | Max. unit size (mm) | 620*813 (24"*32") |
| 7 | Max. working panel size (mm) | 620*900 (24"x35.4") |
| 8 | Max. board thickness (mm) | 12 |
| 9 | Min. board thickness(mm) | 0.3 |
| 10 | Board thickness tolerance (mm) | T<1.0 mm: +/-0.10mm ; T≥1.00mm: +/-10% |
| 11 | Registration tolerance (mm) | +/-0.10 |
| 12 | Min. mechanical drilling hole diameter (mm) | 0.15 |
| 13 | Min. laser drilling hole diameter(mm) | 0.075 |
| 14 | Max. aspect（through hole) | 15:1 |
| Max. aspect（micro-via) | 1.3:1 | |
| 15 | Min. hole edge to copper space(mm) | L≤10, 0.15；L=12-22,0.175；L=24-34, 0.2；L=36-44, 0.25；L＞44, 0.3 |
| 16 | Min. innerlay clearance(mm) | 0.15 |
| 17 | Min. hole edge to hole edge space(mm) | 0.28 |
| 18 | Min. hole edge to profile line space(mm) | 0.2 |
| 19 | Min. innerlay copper to profile line sapce (mm) | 0.2 |
| 20 | Registration tolerace between holes (mm) | ±0.05 |
| 21 | Max. finished copper thickness(um) | Outer Layer: 420 (12oz) Inner Layer: 210 (6oz) |
| 22 | Min. trace width (mm) | 0.075 (3mil) |
| 23 | Min. trace space (mm) | 0.075 (3mil) |
| 24 | Solder mask thickness (um) | line corner : >8 (0.3mil) upon copper: >10 (0.4mil) |
| 25 | ENIG golden thickness (um) | 0.025-0.125 |
| 26 | ENIG nickle thickness (um) | 3-9 |
| 27 | Sterling silver thickness (um) | 0.15-0.75 |
| 28 | Min. HAL tin thickness (um) | 0.75 |
| 29 | Immersion tin thickness (um) | 0.8-1.2 |
| 30 | Hard-thick gold plating gold thickness (um) | 1.27-2.0 |
| 31 | golden finger plating gold thickness (um) | 0.025-1.51 |
| 32 | golden finger plating nickle thickness(um) | 3-15 |
| 33 | flash gold plating gold thickness (um) | 0,025-0.05 |
| 34 | flash gold plating nickle thickness (um) | 3-15 |
| 35 | profile size tolerance (mm) | ±0.08 |
| 36 | Max. solder mask plugging hole size (mm) | 0.7 |
| 37 | BGA pad (mm) | ≥0.25 (HAL or HAL Free：0.35) |
| 38 | V-CUT blade position tolerance (mm) | +/-0.10 |
| 39 | V-CUT position tolerance (mm) | +/-0.10 |
| 40 | Gold finger bevel angle tolerance (o) | +/-5 |
| 41 | Impedence tolerance (%) | +/-5% |
| 42 | Warpage tolerance (%) | 0.75% |
| 43 | Min. legend width (mm) | 0.1 |
| 44 | Fire flame calss | 94V-0 |
| Special for Via in pad products | Resin plugged hole size (min.) (mm) | 0.3 |
| Resin plugged hole size (max.) (mm) | 0.75 | |
| Resin plugged board thickness (min.) (mm) | 0.5 | |
| Resin plugged board thickness (max.) (mm) | 3.5 | |
| Resin plugged maximum aspect ratio | 8:1 | |
| Resin plugged minimum hole to hole space (mm) | 0.4 | |
| Can difference hole size in one board? | yes | |
| Back plane board | Item | |
| Max. pnl size (finished) (mm) | 580*880 | |
| Max. working panel size (mm) | 914 × 620 | |
| Max. board thickness (mm) | 12 | |
| Max. layer-up(L) | 60 | |
| Aspect | 30:1 (Min. hole: 0.4 mm) | |
| Line wide/space (mm) | 0.075/ 0.075 | |
| Back drill capability | Yes | |
| Tolerance of back drill (mm) | ±0.05 | |
| Tolerance of press fit holes (mm) | ±0.05 | |
| Surface treatment type | OSP, sterling silver, ENIG | |
| Rigid-flex board | Hole size (mm) | 0.2 |
| Dielectrical thickness (mm) | 0.025 | |
| Working Panel size (mm) | 350 x 500 | |
| Line wide/space (mm) | 0.075/ 0.075 | |
| Stiffener | Yes | |
| Flex board layers (L) | 8 (4plys of flex board) | |
| Rigid board layers (L) | ≥14 | |
| Surface treatment | All | |
| Flex board in mid or outer layer | Both | |
| Special for HDI products | Laser drilling hole size (mm) | 0.075 |
| Max. dielectric thickness (mm) | 0.15 | |
| Min. dielectric thickness (mm) | 0.05 | |
| Max. aspect | 1.5:1 | |
| Bottom Pad size (under micro-via) (mm) | Hole size+0.15 | |
| Top side Pad size ( on micro-via) (mm) | Hole size+0.15 | |
| Copper filling or not (yes or no) (mm) | yes | |
| Via in Pad design or not ( yes or no) | yes | |
| Buried hole resin plugged (yes or no) | yes | |
| Min. via size can be copper filled (mm) | 0.1 | |
| Max. stack times | any layer | |